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Toshiba Corporation (TOKYO: 6502) ("Toshiba"), Toshiba Memory Corporation ("TMC") and Western Digital Corporation (NASDAQ: WDC) ("Western Digital") have entered into a global settlement agreement to resolve their ongoing disputes in litigation and arbitration, strengthen and extend their relationship, and enhance the mutual commitment to their ongoing flash memory collaboration.

"As the connected consumer has become more mobile, content is now scattered across multiple devices, cloud services and social media," said Glenn Hower, Senior Analyst, Parks Associates. "The fundamental problem for consumers is that they may not remember what content is stored on what account. Device makers and service providers are positioned to provide a better way to integrate and improve the connected consumer experience."

The company also highlighted strong ongoing operations at its joint venture manufacturing facilities in Japan. In particular, the company reiterated its expectation that in calendar year 2017, the output mix of its 64-layer 3D NAND technology, BiCS3, will comprise more than 75 percent of its overall 3D NAND bit supply. The company now believes that, along with its partner Toshiba Corporation, the combined 64-layer 3D NAND bit output of the joint ventures in calendar year 2017 will be higher than any other industry supplier in calendar year 2017.

We note that Toshiba has acknowledged and validated SanDisk’s consent rights on multiple occasions. Furthermore, certain parties identified in Toshiba’s announcement have previously been notified by Western Digital that it considers any effort to aid Toshiba’s breach of its contractual obligations to SanDisk, including any agreement to directly or indirectly transfer any portion of the joint venture, as tortious interference with contract.

WD Red 10TB NAS Hard Drive

The number of vehicles with "connected" systems continues to rise, as does the volume of data generated that must be managed. According to Gartner:

A New State of Storage