The company also highlighted strong ongoing operations at its joint venture manufacturing facilities in Japan. In particular, the company reiterated its expectation that in calendar year 2017, the output mix of its 64-layer 3D NAND technology, BiCS3, will comprise more than 75 percent of its overall 3D NAND bit supply. The company now believes that, along with its partner Toshiba Corporation, the combined 64-layer 3D NAND bit output of the joint ventures in calendar year 2017 will be higher than any other industry supplier in calendar year 2017.